PCB Layout Comparison

Traditional 30×20cm · 7 components · through-hole · passive heatsink
VS
IFX C3+WBG 18×17cm · 5 components · Infineon integrated · 72% smaller
Drag components onto the boards to explore the difference

Traditional Solution

30×20cm — Through-hole, discrete components

REV 1.0
Area: -- Components: 0/7

Components

IFX C3+WBG Solution

18×17cm — Infineon C3M + WBG integrated

REV 2.0
Area: -- Components: 0/5

Size Comparison

--
Smaller footprint
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Power efficiency